Electronics Forum | Thu Apr 22 11:04:58 EDT 1999 | Boca
| | I had someone suggest that they weren't really necessary as long as your process is good. Is this just a way to help you keep an eye on your process? | | | | I was thinking, as we set up our line, our money would be more well spent with control
Electronics Forum | Mon Jan 11 04:42:38 EST 2016 | buckcho
You can do the so called "Golden Sample" with defects from the process. The making of the defects on the board is very important to be as much close to the real ones from the production. How I do it - after the printer I remove paste on some pads, so
Electronics Forum | Thu Apr 27 21:04:33 EDT 2000 | Dave F
Ron: Good news: Nicolet makes excellent machines. Bad news: I�m unaware of a machine with the capabilities you seek. * X-ray machines lack of resolution needed in relation to the crack geometries encountered within a high density single material.
Electronics Forum | Fri Dec 17 12:09:09 EST 1999 | Boca
Outstanding advice gentlemen! To borrow Dave F's line "I'd like to take a bit of a different angle." Ie. a few wave solder specific issues If this assembly is going over wave solder then avoid vias under passive components, it invites solder bal
Electronics Forum | Wed Sep 02 08:44:50 EDT 1998 | Kelly Morris
| Hi, | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it.
Electronics Forum | Thu Mar 02 13:13:14 EST 2006 | Chunks
A ballast is the device needed to energize fluorescent lamps during operation. In all fluorescent lighting systems, the ballast provides the proper voltage to start the lamp and then regulates the electric current flowing through the lamp to stabiliz
Electronics Forum | Wed Jan 17 03:52:20 EST 2007 | Vladimir
Hi, I am process engineer of SMT production. We have some strange problemn with tantalum capacitors. 1 case: If tantalum capacitor placed near BGA and one of his legs is connected to one of the BGA balls, after reflow we can see short between two or
Electronics Forum | Fri Jan 26 16:24:10 EST 2007 | Bob R.
Whether there's a fillet or not depends on the component type. Most have a fillet but some, such as QFN's, don't necessarily have one. Have a look at IPC-610D Workmanship Standards to understand when you should expect one and when you shouldn't. T
Electronics Forum | Mon Feb 12 11:12:16 EST 2007 | davef
Q1. After reflow some boards start producing bumps/bubbles which damage the internal layers causeing PCBs failed in Electrical-testing. How can I eradicate this problem from my assembling process? A1. Find a proper board supplier. Q2. If SMT compon
Electronics Forum | Fri Mar 26 11:31:34 EDT 2010 | rway
I have been using ICT for a number of years. It is still a viable resource for catching defects in the production process. AOI doesn't catch everything, such as bridging on QFN or J-lead devices (this will depend on the type of AOI and camera syste
